Eco-system members join to present the latest product, application and standard developments pushing performance up to 40 Gbps per port
AUSTIN, TEXAS, September 4, 2012 – The RapidIO Trade Association announced its 2012 Global Design Summit schedule, with events slated for Beijing, Shanghai, Seoul, Korea and Tokyo, Japan. These highly anticipated events provide product managers, engineering managers, system architects, and embedded product developers with practical information on RapidIO technology and products they can utilize now in their production products.
Hosted by the RapidIO Trade Association Members, the 2012 Global Design Summit presentations and demonstrations are supplied by the Trade Association member companies. Presenters include the leading vendors of embedded processors, DSPs, RapidIO switches and supporting IP and tools.
“These summits, developed specifically to illustrate how the embedded design community can achieve improved system performance and reliability with the high-speed, flexible RapidIO interconnect and fabric, are among the most highly attended RapidIO design events held each year,” said Sam Fuller, Executive Director of the RapidIO Trade Association. “The member companies of the RapidIO Trade Association are dramatically expanding the presentations and hardware demonstrations this year, with a focus on practical designs and implementations using RapidIO interconnect technology.”
The free, full-day events include technical sessions highlighting RapidIO technology, applications examples in wireless, embedded, imaging, aerospace, medical and video. The vent also covers software considerations, practical design recommendations, and RapidIO products. Technical information on the 3rd Generation RapidIO 10xN standard will also be shared. Technical personnel from Trade Association member companies will provide a unique opportunity for attendees to interact directly with RapidIO Technology experts and get their specific questions answered. A complimentary light breakfast, lunch and snacks will be provided.
Global RapidIO Design Summits Schedule
Seoul, Korea – Wednesday Oct. 31, 2012
Beijing, China – Friday Nov. 2, 2012
Shanghai, China – Monday Nov. 5, 2012
Tokyo, Japan – Thursday Nov. 8, 2012
Additional details can be found on www.RapidIO.org. Dates of these events are subject to change, and interested attendees are asked to check the web site often for location and agenda information.
RapidIO Trade Association
The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO and ANSI-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at www.RapidIO.org.
RapidIO Trade Association