Global RapidIO Design Summits Scheduled for Asia 2009

Eco-system members join to present the latest product, application and standard developments in an informative, easy-to-join forum.

AUSTIN, TEXAS, July 21, 2009 – The RapidIO Trade Association announced its Fall 2009 Global RapidIO Design Summit schedule, with events slated for Beijing, Shanghai, Shenzhen and Tokyo, Japan. These highly anticipated events provide engineering managers, system architects, and embedded product developers with practical information on RapidIO technology and products they can utilize now in their production products.
Hosted by Integrated Device Technology, the 2009 Global Design Summit presentations and demonstrations are supplied by the Trade Association member companies. Presenters include Texas Instruments, Freescale Semiconductor, AMCC, Altera, Xilinx, IDT, FET, CommAgility, NAT and many more.
“These summits, developed specifically to illustrate how the embedded design community can achieve improved system performance and reliability with the high-speed, flexible RapidIO interconnect and fabric, are among the most highly attended RapidIO design events held each year,” said Keith Woodard, chairman of the RapidIO Trade Association Marketing Working Group. “The member companies of the Trade Association are dramatically expanding the presentations and hardware demonstrations this year, with a focus on practical designs and implementations using RapidIO interconnect technology.”
The free, full-day events include technical sessions highlighting RapidIO technology, applications examples, software considerations, practical design recommendations, and RapidIO products. In addition, a technology lab will feature multi-vendor RapidIO interoperability demonstrations using state-of-the-art RapidIO products from multiple vendors. Technical personnel from Trade Association member companies will provide a unique opportunity for attendees to interact directly with RapidIO Technology experts and get their specific questions answered. A complimentary light breakfast, lunch and snacks will be provided.

Global RapidIO Design Summits Schedule
Beijing, China – Friday Oct. 16, 2009
Shanghai, China – Monday Oct. 19, 2009
Shenzhen, China – Thursday Oct. 22, 2009
Tokyo, Japan – Monday Oct. 26, 2009

Additional details can be found on Dates of these events are subject to change, and interested attendees are asked to check the web site often for location and agenda information.
RapidIO Trade Association
The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO and ANSI-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO specification, products, design tools, member companies, and membership is available at